ENTEK® PLUS HT

Organic Solderability Preservative, Nine Lead-free Reflows

ENTEK PLUS HT has been specially formulated to exceed the requirements of today's most demanding lead-free assembly processes. Based on the existing and patented ENTEK PLUS technology, this latest innovation provides exceptional solderability through multiple lead-free reflows. Benefits include:

Highest reliability BGA solder joint strengths
RoHS and WEEE compliant
Robust, lowest cost lead-free finish
Full compatibility with existing equipment
Stable, reworkable and predictable process
No-clean assembly process compatibility
Formulated for mixed metal surfaces (gold surfaces)
Meets and exceeds assembly requirements for high yield, high reliability production, RoHS compliant
Based on ENTEK PLUS technology

For more information, please click here and request via email.