Enthone® PWB fabrication chemistries are widely specified and used by the world's leading PWB fabricators, assemblers and OEMs. Our lead-free final finishes are the industry's leading and most trusted alternatives to hot air solder leveling and include a comprehensive line of organic solderability preservatives, immersion silver, as well as other metallic alternatives to meet today's most complex PWB challenges. Enthone direct metallization processes, acid coppers, oxide alternatives, and solder masks have become the industry standards for high yields and trouble-free fabrication.

Please select a Trade Name, Application, or Process from the above menus to view product details within the PWB Fabrication Chemistry section of the Enthone web site.

Process
Cleaners and Conditioners
Equipment Cleaners
Microetches
Oxides and Oxide Alternatives
Desmear Etchback Removal
Electroless Copper Processing
Direct Metallization
Electroplate
Electrolytic Copper/Tin
Deep Tank Electrolytic Nickel/Gold
TAB Electrolytic Nickel/Gold
Tin/Tin-Lead Stripping
Imaging Technologies
Dry Film Resists
Primary Resists
Thermal Cure Solder Masks
UV-Curable Solder Masks
Photoimageble Solder Masks
Nomenclature Inks
Solder Mask Stripping
Screen Cleaners
Resist Strippers
Developers
Defoamers
Final Finishes (HASL Alternatives)
Hot Air Solder Leveling

	Cleaners and Conditioners
Products Process/Type Features/Benefits Americas Asia Europe AKTIPUR® AS Pattern Plate Panel Plate Developed especially for use with the ENVISION® DMS-E direct metallization process. Used prior to acid copper in pattern plate and panel applications. Compatible with dry film. AKTIPUR® HE Innerlayer Treatment A modified, low foam version of AKTIPUR AS for use in horizontal, conveyorized equipment. ENPLATE® AD-482 Innerlayer Treatment Cu/Tin and Ni/Au Electroplate HASL Pre-Clean Immersion acid cleaner provides same unique benefits as ENPLATE AD-488 spray cleaner. Used as part of the ENPLATE AD-482 pattern plate cleaning system, ENPLATE AD-482 chelated formulation loosens and removes residual dry film binder materials, oils and light soils from copper substrates. Cleans copper traces without lifting or softening resists. Optimum copper-to-copper adhesion is assured. ENPLATE® AD-488 Innerlayer Treatment Cu/Tin and Ni/Au Electroplate Final Finish (EN/Au) HASL Pre-Clean Spray cleaner removes chromate-based conversion coatings, copper oxidation resulting form baking or storage, light shop soils and handling oils such as fingerprints. Low temperature operation allows for in-line horizontal processing. ENPLATE® ILC-1000 Innerlayer Treatment Acid-based spray cleaner removes chromate layers, sulfide film and oxides without attacking the copper surface. ENTHONE® CE-2220 HASL Pre-clean Innerlayer Treatment Persulfate acid cleaner/microetch is rapid acting and very free rinsing in hot or cold water. Does not contain any glycol ether solvents. ENTHONE® CE-2254 Innerlayer Image Outerlayer Image Liquid Imaging Aggressive, spray acid cleaner for the removal of oxides, fingerprints, anti-tarnish and chromate coatings from copper. Non-etching, rapid acting and free rinsing. Does not contain any glycol ether solvents. ENTHONE® PC-7078 Innerlayer Treatment Acid copper cleaner designed to remove light soils, such as fingerprints in order to provide a clean water break surface. Formulated for use in either spray or immersion operations. ENTHONE® PC-7096 Innerlayer Treatment Specifically designed to be used as a pre-cleaner prior to AlphaPREP PC-7025 coating on copper. It is a highly concentrated, strongly alkaline cleaner formulated to remove light organics and dry film residues. ENTHONE PC-7096 is suitable for spray , flood or dip applications and has a long bath life.

	Equipment Cleaners
Products Process/Type Features/Benefits Americas Asia Europe ENTHONE® MS-1130 Innerlayer Image Outerlayer Image Liquid Imaging Concentrated alkaline cleaner developed for equipment cleaning and descaling applications. Extremely effective for cleaning resist stripping and developer units. Ideal for cleaning other types of equipment. ENTHONE® MS-1131 Innerlayer Image Outerlayer Image Liquid Imaging HASL Liquid product formulated for cleaning the process chambers in HASL, developing or stripping equipment (dry film or liquid photoimageable resists). ENTHONE® PC-4510 Liquid Imaging Concentrated alkaline stripper removes cured and uncured solder resists. May also be diluted as a cleaner for resist stripping and ink developer equipment. ENTHONE® PC-7918 Jig Stripper Post Electroplate Specially formulated to strip tin, tin-lead and copper from electroplating jigs by simple immersion at room temperature.

	Microetches
Products Process/Type Features/Benefits Americas Asia Europe ENPLATE® AD-485 Innerlayer Treatment Electroless Copper Cu/Tin and Ni/Au Electroplate Final Finish (EN/Au) HASL Pre-Clean When used with sulfuric acid, the superior microetch provides a production-proven alternative for stripping zincates without the use of nitric acid. ENPLATE® E-462 HASL Microetch Hydrogen peroxide/sulfuric acid microetch effectively inhibits hydrogen peroxide decomposition accelerated by copper ions and elevated operating temperatures. ENPLATE E-462 provides a controlled etch rate and is recyclable. ENTHONE® CE-2209 HASL Pre-clean Concentrated proprietary persulfate cleaner/microetch produces uniform, bright copper surfaces. Rinses easily and completely. Simple waste treatment. ENTHONE® CE-2220 Innerlayer Treatment HASL Pre-clean Persulfate acid cleaner/microetch is rapid acting and very free rinsing in hot or cold water. Does not contain any glycol ether solvents. ENTHONE® PC-5760 Final Finish HASL Microetch Innerlayer Image Outerlayer Image Innerlayer Treatment Monopersulphate-based, liquid microetch is ideal prior to HASL, and can be used also as the pretreatment cleaner in Final Finishes. ENTHONE® PC-7016 Innerlayer Image Outerlayer Image Liquid Imaging HASL Pre-clean / Microetch Peroxide/sulfuric cleaner/microetch is suitable for spray and immersion applications. Ideally suited to prepare the copper surface prior to HASL or resist application (both liquid and dry film). ENTHONE® PC-7077 HASL Microetch Innerlayer Image Persulfate-based, liquid copper conditioner removes chromate conversion film and provides uniform, roughened topography. Sold as ENTHONE PC-7036 in Asia.

	Oxides and Oxide Alternatives
Products Process/Type Features/Benefits Americas Asia Europe AlphaPREP® PC-7030 Innerlayer Treatment Oxide Replacement System AlphaPREP PC-7030 is specially formulated for low etch/high capacity operations using horizontal or vertical equipment. The patented and environmentally friendly peroxide-sulfuric based chemistry produces an organo-metallic coating that delivers exceptional bonding performance between dielectric and copper at very low copper etch factors... ENBOND® Oxide Technologies Innerlayer Treatment ENBOND MB-500 oxide produces oxide films with a crystal morphology…

	Desmear Etchback Removal
Products Process/Type Features/Benefits Americas Asia Europe ENVISION® MLB 2000 Desmear/Etchback ENVISION MLB 2000 desmear/etchback process cleans and conditions small through-holes (less than 10 mils or 100µm)…

	Electroless Copper Processing
Products Process/Type Features/Benefits Americas Asia Europe ENVISION® 2061 Clean/Condition Single-step alkaline cleaner/conditioner for hole wall treatment. Extremely effective on hard-to-catalyze surfaces. Removes fingerprints and other light soils. Designed primarily for use on flex and rigid-flex substrates, it can also be used in mixed lines on double-sided or multilayer product. ENVISION® 2080 Microetch Oxysulfate copper microetch is ideally suited to remove tarnish and oxidation from the copper surface. Yields optimum surface topography for excellent copper-to-copper adhesion. ENVISION® 2095 Pre-dip Powder concentrate pre-dip is a high chloride, low acid replacement for acid pre-activation. Supplies chloride ions without increasing acidity; minimizes “pink ring” in multilayer processing. ENVISION® 2105 Activation Low acid concentration activator for through-hole plating is specially engineered for a highly active, extremely small palladium-tin species. The activator ensures complete and uniform palladium coverage on ALL dielectrics. Low concentration of palladium in the lowest acid media available minimizes lateral erosion and reduces operating costs. Extremely tolerant to contamination, yielding excellent stability and long solution life. ENVISION® 2110 Accelerator Fluoride-free post-activator ensures complete electroless copper coverage on glass fibers and all dielectrics. Effectively activates the palladium without inhibiting activator adhesion to glass fibers. Yields no voids and black holes in backlight test. ENVISION® EC-2130 Series Electroless Copper Low formaldehyde, high-build, EDTA-based copper deposits 1 – 1.5 microns of copper in 12 – 15 minutes or 2.0 – 2.5 microns of copper in 30 minutes. (Deposit thickness can be controlled by adjustment of the operating temperature.) Recommended for use over a wide operating range and loading conditions. Excellent in-tank stability; lowest formaldehyde level available; easily waste treatable. ENVISION® EC-2150 Series Electroless Copper Room temperature, low-build copper is used for flash-type plating. Yields fine, crystalline copper deposits of 0.5 – 1.0 microns in 30 minutes. Promotes the formation of smooth void-free electrodeposits. Ideal for intermittent, low loading conditions.

	Direct Metallization
Products Process/Type Features/Benefits Americas Asia Europe ENVISION® HDI Direct Metallization System ENVISION HDI is a single-pass, direct metallization system that provides complete coverage of blind vias and high aspect ratio through-holes...

	Electroplate
Products Process/Type Features/Benefits Americas Asia Europe Electrolytic Copper/Tin CUPROSTAR® LP-1 Copper Plate Matte acid copper plating process produces fine crystalline, satin and ductile deposits. Specially formulated for PWBs with high aspect ratios. CUPROSTAR LP-1 acid copper affords simple operation for a single sulfur-free compound... CUPROSTAR® ST Series Copper Plate Super throw, direct current, bright acid copper system designed to meet the distribution, thermal cycle and throwing power requirements of high aspect ratio through-holes and microvia PCB designs. The products provide a low cost alternative, yielding results similar to pulse periodic reverse plating systems… CUPROSTAR® CVF1 Copper Plate Acid copper plating process is specially developed for filling blind microvias and plating through-holes simultaneously in vertical DC applications. CUPROSTAR CVF1 fills blind microvias flush with the surface, completely eliminating the potential for cavities, and the entrapment of moisture or residues, while significantly reducing solder joint voids associated with "via –in-pad" applications. The process does not require electrolytic regeneration, continuous carbon filtration or troublesome start-up and shutdown procedures. CUPROSTAR CVF1 delivers the following benefits: 100% via fill for large and small vias Throwing power greater than 90% with 5:1 aspect ratio plated through-holes Capable of panel and pattern plating Fully analyzable and controllable single components in predip and plating bath CUPROSTAR® HZ Copper Plate Matte acid copper process is specially modified formulated to meet the demands of horizontal conveyorized plating using insoluble anodes. CUPROSTAR HZ provides high stability, without the necessity for short or medium term cleaning procedures. Dependent on the equipment design, current densities up to 8 ASD are possible. DC-operation delivers excellent throwing power results. Ideally suited for use with ENVISION HDI. STANNOSTAR® GSM Tin Plate Sulfuric acid-based, matte tin process produces a dense, fine structured layer that is resistant to common etchants. Compatible with dry films. Deep Tank Electrolytic Nickel/Gold AUTRONEX® C-DT Gold Plate Cobalt-hardened gold process provides exceptional distribution. Extremely stable and controllable deposit performances yields reproducible final product. Completely analyzable, a low gold content reduces precious metal inventory, cuts drag-out and refining costs… LECTRO-NIC® Series Nickel Plate Nickel processes produce slightly compressive or tensile stressed, semi-bright, ductile deposits. Available in sulfate and sulfamate formulations for use with soluble and insoluble anodes. PUR-A-GOLD® 202B Gold Plate Exhibits same unique benefits as PUR-A-GOLD 540. PUR-A-GOLD® 540 Gold Plate Soft gold process produces high purity, lemon-yellow gold deposits. Specifically designed to provide superior distribution for deep tank plating of COB technology. Fine grained deposit ensures consistent bonding results and uniform appearance. Exceptional distribution minimizes overplate and reduces gold usage. Low gold content in solution reduces precious metal inventory. Stable and controllable electrolyte is fully analyzable, reducing downtime and improving process control… SULFAMEX® Nickel Plate Nickel sulfamate plating solutions produce pure, ductile, fine grained, matte, low stress deposits. Easy to control and maintain. TAB Electrolytic Nickel/Gold AUTRONEX® CHD Gold Plate High efficiency cobalt hardened gold plating process is optimized for high speed plating. Ideally suited for all types of selective plating. ENSTRIP® 6600SX Strip Hydrogen peroxide-based tin and tin-lead stripper yields superior metal holding capacity for economical operation. Consistently maintains a high-speed stripping rate and low etch rate. LECTRO-NIC® Series Nickel Plate High speed, sulfate-based nickel electroplating process used with soluble and insoluble anodes. Produces slightly compressive or tensile stressed, semi-bright, ductile deposits. Tin/Tin-Lead Stripping ENTHONE® PC-2313 Single-step, spray Concentrated alkali-based stripper for removing cured UV and photoimageable solder resists. Fast acting without attacking epoxy laminate. Free rinsing in warm or cold water. ENTHONE® PC-1107/1158 Two-step, spray Stripper leaves a clean, bright and tarnish resistant finish on copper surfaces. Extremely economical due to its high metal capacity. ENTHONE® PC-1111/1111Z Single-step, spray No sludge, nitric acid based stripper removes plated and fused tin-lead. Excellent for selective solder stripping applications, as well as for removing fused solder from tabs for subsequent nickel and gold plating. Non-peroxide formulation contains no fluorides or fluorborates. Exothermic heat generation, white residues and “measling” of the laminate are eliminated. ENTHONE® PC-1113 Single-step, spray or immersion Nitric acid based stripper provides ultra-low copper attack. Contains no fluoride, fluorborate, peroxide or thiourea. Features a high loading capacity, fast stripping speed, and sludge-free operation. ENTHONE® PC-1125/1144 Two-step, immersion High performance, ferric/nitric solder stripper with fast tin and tin/lead stripping capability. Easy bath control. ENTHONE® PC-1158 Single-step, spray Complexer-free, low cost nitric acid based stripper. Contains no fluoride, fluorborate, peroxide or chelates. ENTHONE® SS-2859 Peroxide/Biflouride, Single-step, spray or immersion Fast acting. Very high capacity and cost-effective performance. Adding peroxide can increase speed and capacity.

	Imaging Technologies
Products Process/Type Features/Benefits Americas Asia Europe Dry Film Resists PHOTEC* Dry Film Photoresists Innerlayer Image Outerlayer Image Consistently provides the highest first-pass yields on fine line, high circuit density PCBs… Primary Resists ENPLATE® UR-578B Outerlayer Image UV-curable plate and etch resist is specially formulated for acidic and ammoniacal plating processes. Suitable for hand, semi-automatic and high-speed fully automated screen printing operations. Each formulation meets industry requirements for fast, hard cure. Allows for fully aqueous stripping… ENTHONE® ER-2005 Outerlayer Image Thermal cure, screen printable blue etch resist has a medium viscosity with consistent printing performance. Rheology is best suited for polyester mesh screens. Resist withstands cupric and ferric chloride etchants. May be air dried. Alkaline strippable. ENTHONE® PR-3003 Outerlayer Image Thermal cure resist is alkaline strippable. High solids content, medium viscosity, screen printable, high thixotropy for fine line printing. May be used as either a plating or etch resist. Withstands all acid plating solutions and alkaline or acid etchants. Fast drying. Thermal Cure Solder Masks ENTHONE® SR-1000 Liquid Imaging Unequaled adhesion to a variety of substrates. One-component, high solids content, epoxy-based resist with matte finish. Screen printable, convection or IR cure. May be used for hole plugging. Easy to use. Meets or exceeds IPC-SM-840B, Class 3 requirements. ENTHONE® SR-2020 Liquid Imaging High gloss, two-component epoxy based mask. Shorter cure time than one component systems. Screen printable, convection or IR cure. Meets or exceeds IPC-SM-840B, Class 3 requirements. UV-Curable Solder Masks ENPLATE® USR-7 Liquid Imaging Screenable formulations for use over copper, tin, and nickel plated circuitry. Provides a tough, protective film that withstands the rigors of HASL. Allows fine tuning of the screening operation to provide the optimum coverage and image resolution. Superb printability in manual, semi-automatic or automatic screening operations. Available in a variety of colors. Meets or exceeds IPC-SM840, Class 3 requirements. UL listed, 94V-0… ENPLATE® USR-9148 Liquid Imaging Screen printable, designed for solder mask over bare copper applications. The wet film cures in seconds to form a tough, protective film that withstands HASL. Meets or exceeds IPC-SM840, Class 3 requirements. UL listed, 94V-0… Photoimageble Solder Masks ENPLATE® DSR-3241 Liquid Imaging Used and specified by over 200 PCB fabricators and 350 assembler/OEMs worldwide, ENPLATE DSR-3241 LPSMs deliver short cycle times and high yields… Nomenclature Inks ENPLATE® USI-210WP Liquid Imaging Excellent opacity and printability; high resistance to chemical and soldering processing. Superior adhesion to UV-curable, liquid photoimageble, dry film and thermal cure solder masks. Available in white. ENPLATE® PNI-1000W Liquid Imaging Two component, liquid photoimageable ink is applied by flood screen printing, dried and exposed with phototool in a hard contact mode. Fully aqueous developable process. Available in white. ENPLATE® USI-220 Liquid Imaging Screen imaged nomenclature ink. Available in black and yellow… ENTHONE® 10 Series Liquid Imaging One component, epoxy based ink has the highest degree of thermal and chemical resistance. Excellent adhesion to all types of solder masks and other substrates. ENTHONE® 50 Series Liquid Imaging Two component, epoxy based ink with a selection of catalysts and a wide latitude in cure schedules-ambient, heat or IR. Screen printing or thinned for spray applications. Available in many colors. ENTHONE® LEGEND 60 Liquid Imaging Two component, laser markable, thermal cure ink is available in white or yellow. Superior adhesion to solder mask and laminate substrates. Will withstand multiple heat cycles without yellowing. Solder Mask Stripping ENTHONE® MS-1114 Liquid Imaging Concentrated alkali-based stripper for removing cured UV and photoimageable solder resists. Fast acting without attacking epoxy laminate. Free rinsing in warm or cold water. ENTHONE® PC-4510 Liquid Imaging Concentrated alkaline stripper removes cured and uncured solder resists. May also be diluted as a cleaner for resist stripping and ink developer equipment. ENTHONE® PC-4529 Liquid Imaging Alkaline stripper designed to effectively remove fully cured dry film solder mask, most photoimageable solder masks and UV and thermal nomenclature inks from PCBs by dip application. It is especially effective in removing aqueous based solder masks without causing damage to the circuitry or the laminate. Screen Cleaners ENPLATE® SOLVENT 33 Liquid Imaging Cleaning solution designed specifically for the removal of UV and solvent-based resists from the imagined screen. Compatible with most commonly used emulsions. ENTHONE® PC-7886 Liquid Imaging Water soluble, biodegradable cleaner removes uncured epoxy-based and acrylic-based solder resists, as well as legend inks from screens, PCBs and equipment without leaving any residue.