AKTIPUR® AS

Pattern Plate
Panel Plate

Developed especially for use with the ENVISION® direct metallization processes. Used prior to acid copper in pattern and panel applications. Compatible with dry film.

AKTIPUR® HE

Innerlayer Treatment

A modified, low foam version of AKTIPUR AS for use in horizontal, conveyorized equipment.

ENPLATE® AD-482

Innerlayer Treatment

Cu/Tin and Ni/Au Electroplate

HASL Pre-Clean

Used as part of the ENPLATE AD-482 pattern plate cleaning system, ENPLATE AD-482 chelated formulation loosens and removes residual dry film binder materials, oils and light soils from copper substrates. Cleans copper traces without lifting or softening resists. Optimum copper-to-copper adhesion is assured.

ENPLATE® AD-488

Innerlayer Treatment

Cu/Tin and Ni/Au Electroplate

HASL Pre-Clean

Spray cleaner removes chromate-based conversion coatings, copper oxidation resulting form baking or storage, light shop soils and handling oils such as fingerprints. Low temperature operation allows for in-line horizontal processing.

ENPLATE® ILC-1000

Innerlayer Treatment

Acid-based spray cleaner removes chromate layers, sulfide film and oxides without attacking the copper surface.

ENTHONE® CE-2254

Innerlayer Image

Outerlayer Image

Liquid Imaging

Aggressive, spray acid cleaner for the removal of oxides, fingerprints, anti-tarnish and chromate coatings from copper. Non-etching, rapid acting and free rinsing. Does not contain any glycol ether solvents.

ENTHONE® PC-7078

Innerlayer Treatment

Acid copper cleaner designed to remove light soils, such as fingerprints in order to provide a clean water break surface. Formulated for use in either spray or immersion operations.

ENTHONE® PC-7096

Innerlayer Treatment

Highly concentrated, strongly alkaline cleaner formulated to remove light organics and dry film residues. ENTHONE PC-7096 is suitable for spray, flood or dip applications and has a long bath life.

ENTHONE® MS-1130

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Outerlayer Image

Liquid Imaging

Concentrated alkaline cleaner developed for equipment cleaning and descaling applications. Extremely effective for cleaning resist stripping and developer units. Ideal for cleaning other types of equipment.

ENTHONE® MS-1131

Innerlayer Image

Outerlayer Image

Liquid Imaging

HASL

Liquid product formulated for cleaning the process chambers in HASL, developing or stripping equipment (dry film or liquid photoimageable resists).

ENTHONE® PC-4510

Liquid Imaging

Concentrated alkaline stripper removes cured and uncured solder resists. May also be diluted as a cleaner for resist stripping and ink developer equipment.

ENTHONE® PC-7918 Jig Stripper

Post Electroplate

Specially formulated to strip tin, tin-lead and copper from electroplating jigs by simple immersion at room temperature.

ENPLATE® AD-485

Innerlayer Treatment

Electroless Copper

Cu/Tin and Ni/Au Electroplate

Final Finish (EN/Au)

HASL Pre-Clean

Monopersulphate-based powder formulation features a high copper-holding capacity that generates superior microetch at greatly reduced operating costs. Yields superior surface topography suitable for optimum resist bonding.

ENPLATE® DMA

HASL Microetch

Innerlayer Image

Persulphate-based, microetch removes chromate conversion film and provides uniform, roughened topography.

ENPLATE® E-462

HASL Microetch

Hydrogen peroxide/sulfuric acid microetch effectively inhibits hydrogen peroxide decomposition accelerated by copper ions and elevated operating temperatures. ENPLATE E-462 provides a controlled etch rate and is recyclable.

ENTHONE® CE-2203

HASL Pre-clean

Concentrated proprietary persulfate cleaner/microetch produces uniform, bright copper surfaces. Rinses easily and completely. Simple waste treatment.

ENTHONE® CE-2220

Innerlayer Treatment

HASL Pre-clean

Persulfate acid cleaner/microetch is rapid acting and very free rinsing in hot or cold water. Does not contain any glycol ether solvents.

ENTHONE® PC-5760

Final Finish

HASL Microetch

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Outerlayer Image

Innerlayer Treatment

Monopersulphate-based, liquid microetch is ideal prior to HASL, and can be used also as the pretreatment cleaner in Final Finishes.

ENTHONE® PC-7016

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Outerlayer Image

Liquid Imaging

HASL Pre-clean / Microetch

Peroxide/sulfuric cleaner/microetch is suitable for spray and immersion applications. Ideally suited to prepare the copper surface prior to HASL or resist application (both liquid and dry film).

ENTHONE® PC-7077

HASL Microetch

Innerlayer Image

Persulfate-based, liquid copper conditioner removes chromate conversion film and provides uniform, roughened topography. Sold as ENTHONE PC-7036 in Asia.

AlphaPREP® PC-7030

Innerlayer Treatment

Oxide Replacement System

AlphaPREP PC-7030 is specially formulated for low etch/high capacity operations using horizontal equipment. The patented and environmentally friendly peroxide-sulfuric based chemistry produces an organo-metallic coating that delivers exceptional bonding performance between dielectric and copper at very low copper etch factors...

ENBOND® Oxide Technologies

Innerlayer Treatment

ENBOND MB-500 oxide produces oxide films with a crystal morphology…

ENVISION® MLB 2000

Desmear/Etchback

ENVISION MLB 2000 desmear/etchback process cleans and conditions small through-holes (75µm or less) by utilizing enhanced through-hole wetting capability for uniform and consistent smear removal by utilizing enhanced through-hole wetting capability for uniform and consistent smear removal. The process includes:

ENVISION MLB 2000 Series Sensitizers: Carefully engineered to thoroughly remove drilling debris, the sensitizers promote rapid, aggressive attack by the oxidizer and prepares the dielectric to exhibit a clean, microroughened surface after treatment through the three-step process. Performs especially well in small holes and all dielectrics, including polymide, and high Tg laminates.

• ENVISION MLB-2010: standard product (vertical operation)


• ENVISION MLB-2012: high temperature applications


• ENVISION MLB-2013 high Tg-special materials

ENVISION MLB 2020/2021 Oxidizers: Formulated with superior wettability for improved small hole solution exchange, the oxidizers provide a controlled “attack” on the dielectric that has been treated with the sensitizer. MLB-2021 provides special advantages for HAR or BMV applications.

ENVISION MLB-2030 or MLB-2035 Neutralizer: Efficiently removing all manganese compound residues on the board surfaces and hole walls, the neutralizer yields ultra-clean, microroughened dielectric surfaces. If frost or glass etch characteristics are desired, ENVISION MLB Glass Frost Additive can be incorporated into the MLB-2030. If ENVISION direct metallization follows the desmear process, MLB-2035 must be used.

For more information, please click here and request via email.

ENVISION® 2061

Clean/Condition

Single-step alkaline cleaner/conditioner for hole wall treatment. Extremely effective on hard-to-catalyze surfaces. Removes fingerprints and other light soils. Designed primarily for use on flex and rigid-flex substrates, it can also be used in mixed lines on double-sided or multilayer product.

ENVISION® 2080

Microetch

Oxysulfate copper microetch is ideally suited to remove tarnish and oxidation from the copper surface. Yields optimum surface topography for excellent copper-to-copper adhesion.

ENVISION® 2095

Pre-dip

Powder concentrate pre-dip is a high chloride, low acid replacement for acid pre-activation. Supplies chloride ions without increasing acidity; minimizes “pink ring” in multilayer processing.

ENVISION® 2105

Activation

Low acid concentration activator for through-hole plating is specially engineered for a highly active, extremely small palladium-tin species. The activator ensures complete and uniform palladium coverage on ALL dielectrics. Low concentration of palladium in the lowest acid media available minimizes lateral erosion and reduces operating costs. Extremely tolerant to contamination, yielding excellent stability and long solution life.

ENVISION® 2110

Accelerator

Fluoride-free post-activator ensures complete electroless copper coverage on glass fibers and all dielectrics. Effectively activates the palladium without inhibiting activator adhesion to glass fibers. Yields no voids and black holes in backlight test.

ENVISION® EC-2130

Electroless Copper

Low formaldehyde, high-build, EDTA-based copper deposits 1 – 1.5 microns of copper in 12 – 15 minutes or 2.0 – 2.5 microns of copper in 30 minutes. (Deposit thickness can be controlled by adjustment of the operating temperature.) Recommended for use over a wide operating range and loading conditions. Excellent in-tank stability; lowest formaldehyde level available; easily waste treatable.

ENVISION® EC-2150

Electroless Copper

Room temperature, low-build copper is used for flash-type plating. Yields fine, crystalline copper deposits of 0.5 – 1.0 microns in 30 minutes. Promotes the formation of smooth void-free electrodeposits. Ideal for intermittent, low loading conditions.

ENVISION® HDI

Direct Metallization System, High Density Interconnect Applications

ENVISION HDI is a single-pass, direct metallization system that provides complete coverage of blind vias and high aspect ratio through-holes. Composed of process chemistry and horizontal equipment, the patented system selectively deposits a thin, highly conductive polymer on resin and glass that easily meets or exceeds all current performance and reliability standards. ENVISION HDI provides an environmentally sound, cost-effective alternative to electroless copper or other direct metallization systems, including palladium, carbon or graphite. The low viscosity of the unique, 3-step process ensures thorough wetting of blind microvias. The selective nature provides a clean copper surface for smooth plated deposits without the use of additional cleaning or microetch steps, resulting in the highest reliability innerlayer connects.

ENVISION HDI includes horizontal equipment specifically engineered for plating of microvias and high aspect ratio through-holes. The equipment features specially designed fluid dynamics and ultrasonics. The equipment ensures excellent metallization that results in a single-pass even with blind vias on both sides.

CUPROSTAR® LP-1

Copper Plate

Matte, acid copper plating process produces fine crystalline, satin and ductile deposits. Specially formulated for PWBs with high-aspect ratios, CUPROSTAR LP-1 acid copper affords simple operation by use of a single, sulfur-free compound. Operates at a wide range of current densities to improve throwing power or to increase production capacity. The copper provides exceptional plating distribution even at elevated temperatures. The final micro-rough deposit provides excellent solder mask and resist adhesion. CUPROSTAR LP-1 is also suited for horizontal, conveyorized DC plating.

CUPROSTAR® ST

Copper Plate

Super throw, direct current, bright acid copper system designed to meet the distribution, thermal cycle and throwing power requirements of high aspect ratio through-holes and microvia PWB designs. The products provide a low cost alternative, yielding results similar to pulse periodic reverse plating systems.

CUPROSTAR® CVF1

Copper Plate

Acid copper plating process is specially developed for filling blind microvias and plating through-holes simultaneously in vertical DC applications. CUPROSTAR CVF1 fills blind microvias flush with the surface, completely eliminating the potential for cavities, and the entrapment of moisture or residues, while significantly reducing solder joint voids associated with "via –in-pad" applications. The process does not require electrolytic regeneration, continuous carbon filtration or troublesome start-up and shutdown procedures. CUPROSTAR CVF1 delivers the following benefits:

100% via fill for large and small vias

Throwing power greater than 90% with 5:1 aspect ratio plated through-holes

Capable of panel and pattern plating

Fully analyzable and controllable single components in predip and plating bath

CUPROSTAR® HZ

Copper Plate

Based on CUPROSTAR LP-1 chemistry, the acid copper is specially formulated for horizontal, conveyorised DC plating.

STANNOSTAR® GSM

Tin Plate

Sulfuric acid-based, matte tin process produces a dense, fine structured layer that is resistant to common etchants. Compatible with dry films.

AUTRONEX® C-DT

Gold Plate

Cobalt-hardened gold process provides exceptional distribution. Extremely stable and controllable deposit performances yields reproducible final product. Completely analyzable, a low gold content reduces precious metal inventory, cuts drag-out and refining costs.

LECTRO-NIC® Series

Nickel Plate

Nickel processes produce slightly compressive or tensile stressed, semi-bright, ductile deposits. Available in sulfate and sulfamate formulations for use with soluble and insoluble anodes.

PUR-A-GOLD® 202B

Gold Plate

Exhibits same unique benefits as PUR-A-GOLD 540.

PUR-A-GOLD® 540

Gold Plate

Soft gold process produces high purity, lemon-yellow gold deposits. Specifically designed to provide superior distribution for deep tank plating of COB technology. Fine grained deposit ensures consistent bonding results and uniform appearance. Exceptional distribution minimizes overplate and reduces gold usage. Low gold content in solution reduces precious metal inventory. Stable and controllable electrolyte is fully analyzable, reducing downtime and improving process control…

SULFAMEX®

Nickel Plate

Nickel sulfamate plating solutions produce pure, ductile, fine grained, matte, low stress deposits. Easy to control and maintain.

AUTRONEX ® 61/61E

Gold Plate

Cobalt hardened gold process provides exceptional distribution. Extremely stable and controllable electrolyte for consistent and reproducible final product. Completely analyzable, the gold is packaged for optimum stability and advanced process control. Used for all types of plating equipment. Low gold content reduces precious metal inventory, cuts drag-out and refining costs.

AUTRONEX® CHD

Gold Plate

High efficiency cobalt hardened gold plating process is optimized for high speed plating. Ideally suited for all types of selective plating.

ENSTRIP® 6600SX

Strip

Hydrogen peroxide-based tin and tin-lead stripper yields superior metal holding capacity for economical operation. Consistently maintains a high-speed stripping rate and low etch rate.

LECTRO-NIC® Series

Nickel Plate

High speed, sulfate-based nickel electroplating process used with soluble and insoluble anodes. Produces slightly compressive or tensile stressed, semi-bright, ductile deposits.

ENSTRIP ® TL-151

Two-step, immersion

Nitric acid-based, peroxide-free process strips tin or tin-lead deposit down to the copper tin intermetallic layer. PWBs may remain immersed without attack on the copper. Leaves exposed copper clean and bright.

ENSTRIP ® TL-155

Single-step, spray

Leaves exposed copper clean and bright. High loading capacity.

ENTHONE® PC-1107/1158

Two-step, spray

Stripper leaves a clean, bright and tarnish resistant finish on copper surfaces. Extremely economical due to its high metal capacity.

ENTHONE® PC-1111/1111Z

Single-step, spray

No sludge, nitric acid based stripper removes plated and fused tin-lead. Excellent for selective solder stripping applications, as well as for removing fused solder from tabs for subsequent nickel and gold plating. Non-peroxide formulation contains no fluorides or fluorborates. Exothermic heat generation, white residues and “measling” of the laminate are eliminated.

ENTHONE® PC-1113

Single-step, spray or immersion

Nitric acid based stripper provides ultra-low copper attack. Contains no fluoride, fluorborate, peroxide or thiourea. Features a high loading capacity, fast stripping speed, and sludge-free operation.

ENTHONE® PC-1125/1144

Two-step, immersion

High performance, ferric/nitric solder stripper with fast tin and tin/lead stripping capability. Easy bath control.

ENTHONE® PC-1158

Single-step, spray

Complexer-free, low cost nitric acid based stripper. Contains no fluoride, fluorborate, peroxide or chelates.

ENTHONE® SS-2859

Peroxide/Biflouride, Single-step, spray or immersion

Fast acting. Very high capacity and cost-effective performance. Adding peroxide can increase speed and capacity.

PHOTEC* Dry Film Photoresists

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Outerlayer Image

Consistently provides the highest first-pass yields on fine line, high circuit density PWBs…

ENTHONE® ER-2005

Outerlayer Image

Thermal cure, screen printable blue etch resist has a medium viscosity with consistent printing performance. Rheology is best suited for polyester mesh screens. Resist withstands cupric and ferric chloride etchants. May be air dried. Alkaline strippable.

ENTHONE® M Series

Liquid Imaging

Two component, epoxy-based masking ink used in conjunction with liquid catalyst and cured at elevated or room temperature. Excellent adhesion to glass, metal and thermosetting plastics. Exceptional chemical and thermal resistance properties. Complies with MIL-l-43553 Revision A & A-A-56032 Revision D.

ENTHONE® PR-3003

Outerlayer Image

Thermal cure resist is alkaline strippable. High solids content, medium viscosity, screen printable, high thixotropy for fine line printing. May be used as either a plating or etch resist. Withstands all acid plating solutions and alkaline or acid etchants. Fast drying.

ENTHONE® SR-1000
ENTHONE SR-1010

Liquid Imaging

Unequaled adhesion to a variety of substrates. One-component, high solids content, epoxy-based resist with matte finish. Screen printable, convection or IR cure. May be used for hole plugging. Easy to use. Meets or exceeds IPC-SM-840B, Class 3 requirements. Available in standard (1010) and high (1010) viscosity versions.

ENTHONE® SR-1020

Liquid Imaging

One component, high solids content, epoxy-based resist that exhibits excellent adhesion to copper, good dielectric qualities and is suitable for the encapsulation of nickel and gold circuitry. The resist can be wave or dip soldered and will withstand solder leveling by hot oil, hot air or hydro-squeegee methods. This screen printable solder resists cure to a gloss finish and provide an excellent base for the adhesion of legend ink and conformal coatings.

ENPLATE® USI-210WP

Liquid Imaging

Excellent opacity and printability; high resistance to chemical and soldering processing. Superior adhesion to UV-curable, liquid photoimageable, dry film and thermal cure solder masks. Available in white.

ENTHONE® 50 Series

Liquid Imaging

Two component, epoxy based ink with a selection of catalysts and a wide latitude in cure schedules-ambient, heat or IR. Screen printing or thinned for spray applications. Available in many colors. Complies with MIL-l-43553 Revision A & A-A-56032 Revision D.

ENTHONE® 60 Series

Liquid Imaging

Two component, laser markable, thermal cure ink. Superior adhesion to solder mask and laminate substrates. Will withstand multiple heat cycles without yellowing.

ENTHONE® MS-1109

Liquid Imaging

Concentrated alkali-based stripper for removing cured UV and photoimageable solder resists. Fast acting without attacking epoxy laminate. Free rinsing in warm or cold water.

ENTHONE® PC-4510

Liquid Imaging

Concentrated alkaline stripper removes cured and uncured solder resists. May also be diluted as a cleaner for resist stripping and ink developer equipment.

ENTHONE® PC-4529

Liquid Imaging

Alkaline stripper designed to effectively remove fully cured dry film solder mask, most photoimageable solder masks and UV and thermal nomenclature inks from PWBs by dip application. It is especially effective in removing aqueous based solder masks without causing damage to the circuitry or the laminate.

ENTHONE® PC-7886

Liquid Imaging

Water soluble, biodegradable cleaner removes uncured epoxy-based and acrylic-based solder resists, as well as legend inks from screens, PWBs and equipment without leaving any residue.

ENTHONE® SC-1710

Liquid Imaging

Water soluble, non-chlorinated cleaner which dissolves uncured solder mask, legend ink, and screen resists from screens and boards. Slow evaporating rate, economical to use.

ENSTRIP ® Fr 150 CN

Innerlayer Image, Outerlayer Image

Additive for caustic-based strippers.

ENTHONE® PC-4025

Outerlayer Image

Aqueous, alkaline stripper may be used on fully aqueous dry film, as well as aqueous and semi-aqueous resists. Contains inhibitors to reduce copper and lead build-up in the solution. Leaves copper surfaces bright and untarnished. PC-4025 is particularly effective at removing entrapped film particles and eliminating shorts. Suitable for LDI films.

ENTHONE® PC-4028

Innerlayer Image, Outerlayer Image

Cost-effective and fast dry film resist stripper; contains caustic.

ENTHONE® PC-4038

Innerlayer Image

High speed, aqueous dry film resist stripper specially formulated for innerlayers.

ENTHONE® PC-4052

Outerlayer Image

Highly concentrated alkaline stripper for fully aqueous and LDI film removal. Especially effective for advanced outerlayer applications resulting in high yields and a bright copper finish.

ENTHONE® PC-4055

Innerlayer Image, Outerlayer Image

Most versatile stripper for all resist types; excellent for overplate resist. Spray or immersion formuations.

ENTHONE® PC-4069

Innerlayer Image

Outerlayer Image

Alkaline liquid concentrate designed for complete removal of fully aqueous dry film resists. It can be used in spray or immersion systems. Proprietary ingredients reduce metal content and a special anti-tarnish results bright, oxide-free surfaces.

ENTHONE® PC-4077

Innerlayer Image

Outerlayer Image

Cost-effective, alkaline liquid concentrate is designed to strip fully aqueous dry film and ink film resists at low operating concentrations. Most suitable for spray applications, the stripper ensures bright, tarnish-free copper surfaces.

ENTHONE® RS-2610

Innerlayer Image

High speed, aqueous resist stripper specially formulated for innerlayers.

ENSTRIP® RS-9908

Innerlayer Image

Outerlayer Image

Highly concentrated, ultra-filtered sodium carbonate-based developer for fine line dense circuitry. Easy to use and economical, it is ideally suited for pH or conductivity controlled feed and bleed replenishment systems.

ENTHONE® MS-1115

Innerlayer Image

Outerlayer Image

Concentrated potassium carbonate developer.

ENTHONE® MS-1116

Innerlayer Image

Outerlayer Image

Concentrated potassium carbonate developer with built-in additive for clean operation. Economical. Sumps, jets and pH probe kept clean and scale-free.

ENPLATE® Antifoam NS

Innerlayer Image

Outerlayer Image

Multi-purpose defoamer for waste water treatment, flipper, etc.

ENTHONE® PC-4707

Outerlayer Image

Inhibitor/defoamer additive for caustic strippers

ENTHONE® PC-4712

Outerlayer Image

Defoamer additive for caustic strippers.

ENTHONE® PC-4720

Innerlayer Image

Outerlayer Image

Solvent-free, highly concentrated foam suppressant is suitable for general purpose applications.

ENTHONE® PC-4721

Innerlayer Image

Outerlayer Image

Solvent-free defoamer contains no silicone. Highly effective at very low concentrations in a range of applications.

ENTHONE® PC-4772

Outerlayer Image

Multipurpose defoamer for resist stripper and developer solutions.

ENTHONE® PC-754

Innerlayer Image

Outerlayer Image

Liquid Imaging

Economical solvent-type defoamer for resist stripping or developing.

AlphaSTAR®

Lead-Free, Immersion Silver

AlphaSTAR microvoid resistant, immersion silver is specially designed to meet the most complex PWB lead-free assembly requirements. The process delivers superior tarnish resistance, high first-pass yields and excellent solderability that results in exceptional reliability...

ENTEK® PLUS HT

Organic Solderability Preservative

ENTEK PLUS HT has been specially formulated to exceed the requirements of today‘s most demanding lead-free assembly processes. Based on the existing and patented ENTEK PLUS technology, the OSP provides exceptional solderability through multiple lead-free reflows. Advanced pretreatment chemistry includes a highly stable microetch bath that will not aggressively attack mixed metal surfaces (e.g. OSP and gold). Process flexibility is improved due to its mild anti-tarnish capability. A bright, uniform etch is achieved on the most complex patterns with minimal or no galvanic etch...

ORMECON® CSN Classic

Immersion Tins

Extremely stable immersion tin processes based on a patented, Organic Metal® predip reduces Cu/Sn diffusion speed by as much as 65% and catalyzes the Sn deposition. As a result, exceptional solderability and appearance, even after multiple lead-free assembly reflows, is achieved. The surface finish has the industry's longest shelf life. An organic metal predip is available to reduce whisker growth before assembly.

ORMECON® CSN Nano

Tin Nanofinish®

Patented, immersion tin nanofinish® produces a thin, 0.35 micron tin coating that decreases processing time, energy usage and equipment costs. The Organic Nanometal® process employs patented Organic Metal technology to prevent solder mask attack, discoloration and other defects commonly associated with conventional immersion tin processes. ORMECON CSN Nano offers exceptional solderability, regardless of the amount of free pure tin that remains on the surface, as the organic nanometal protects the copper-tin intermetallic from being oxidized. The process may be safely used in lead-free, multi-step assembly processes.

OrmeSTAR™ Ultra

Organic Metal-based, Nanofinish®

OrmeSTAR Ultra is an Organic Metal-based final finish. This revolutionary, patented nanofinish technology consumes approximately 90% less energy and creates less waste versus electroless nickel / immersion gold (ENIG) and other traditional metallic final finishes. When compared to ENIG, OrmeSTAR Ultra reduces process time by 75%. The finish costs 30% less then ENIG, with no "black pad" risk. The versatile process delivers a high efficiency in application and operation throughout the entire supply chain. To view or download further details (right click, "Save Target As"), click here.

ALPHA Vaculoy (SnPb)

Solder Bar

Economical ER grade HASL solder. Superior flow and wetting capability. Reclaim program available.

ALPHA Vaculoy SACX

Lead-free Solder Bar

Economical lead-free grade HASL solder. High purity, excellent value. Reclaim program available.

ENTHONE® AF-1853

Oil

Used in horizontal HASL equipment requiring re-circulated stable heat transfer fluid for flowing solder on PWBs. Oil is completely water soluble and biodegradable.

ENTHONE® AF-1863

Flux

Fully stabilized, low viscosity flux for horizontal HASL process. Chloride activated. Used with AF-1864 oil. Combines exceptional coverage and maximum mask protection with low consumption.

ENTHONE® AF-1864

Oil

Highly stabilized oil for horizontal HASL reduces organic breakdown. Ideally suited for hot oil reflow. Does not freeze under cold conditions. Good mask protection and machine lubrication properties.

ENTHONE® AF-1885

Flux

High viscosity flux designed for vertical HASL process, including Quicksilver®* level machines. High performance functional fluid ensures superior heat stability and mask protection combined with excellent coverage.
*Quicksilver® is a registered trademark of Cemco Services Ltd., Petersfield, UK.

ENTHONE® AF-1886

Flux

Low viscosity flux designed for vertical HASL process, especially Quicksilver machines. Total solder coverage on SMD pads. Unique low surface tension properties produce a brilliant finish.

ENTHONE® AF-1928

Flux

Medium viscosity flux design for vertical HASL process, including Quicksilver level machines. Total solder coverage on SMD pads. Unique, low surface tension properties produce a brilliant finish.

ENTHONE® CE-2263

Flux Remover

Removes post-soldering residues of water soluble fluxes. Rapidly removes acids, activators, ionic residues, and flux vehicles without the use of chlorinated hydrocarbons. Economical; used in both spray and immersion equipment.

ENTHONE® HF-2507

Flux

High performance flux specially formulated for horizontal HASL process, especially Alchemy®* machines. Excellent resistance to organic breakdown. Clean running.

*Alchemy® is a registered trademark of Cemco Services Ltd., Petersfield, UK.

ENTHONE® HF-2509

Flux

High temperature flux specially formulated for use in no-lead HASL with Alchemy HASL machines. Intended for use with ENTHONE HO-2508 oil, the flux also works well in standard Sn/Pb (63/37) HASL with reduced evaporation and smoking.

ENTHONE® HO-2508

Oil

High temperature oil developed for use with “no-lead” HASL processing on Alchemy systems. The oil has an extremely high flash point and performs at the elevated temperatures associated with “no-lead” alloys (270 – 290 °C). In standard Sn/Pb HASL process (250 °C), the oil can run in excess of 120 hours at temperature. Produces minimal smoke and emissions.

ENTHONE® PC-6530

Flux

Universal, ultra-low cost flux for use in vertical HASL process. Dip or roller application. Non-foaming.

ENTHONE® PC-7457

Flux

Medium viscosity, heat stabilized, non-VOC flux designed for vertical HASL process. Especially suited for SMT applications. Flux delivers improved first pass coverage, excellent solder deposit uniformity, mirror-bright solder surfaces free of white residues, low ionic contamination values, and improved S.I.R. levels.

ENTHONE® PC-756S
ENTHONE® PC-757S

Flux

Low viscosity, non-foaming fluxes are designed for vertical HASL process. Minimum flux carbonization and low smoking on the molten solder pot surface for reduced equipment maintenance and enhanced PWB quality. Lower viscosity and increased activity allow the fluxes to successfully solder-coat difficult to wet closely spaced circuitry on SMT boards. ENTHONE PC-757S is recommended for SMT boards to successfully solder-coat difficult to wet, smaller diameter plating through-holes, vias and complex circuitry.

ENTHONE® PC-894

Flux

Hot oil reflow flux is designed for vertical HASL process.