• Corrosion & Tarnish Resistance
  • Creep & Flaking Corrosion Resistance
  • Tarnish Resistance
• Resistance to Microvoids
  • What are Planar Microvoids?
  • Why you should care about Microvoids
  • Microvoid Impact and Solder Cracking
  • Intel: AlphaSTAR vs. Historical Production Data
  • Intel: Design of Experiment
  • Intel: Board Failure Percent Due to Microvoids
• Solder Joint Reliability
• Solderability
  • Wave Soldering
  • Wetting Balance Test Results
• Process Overview
  • Process Cycle
  • OEM and Assembler Features and Benefits
  • Fabricator Features and Benefits
  • Test Results (SIR, EM, UL)
• AlphaSTAR Creates Value
  • AlphaSTAR Creates Value
  • AlphaSTAR Advantage

Wave Soldering

AlphaSTAR Exhibits Exceptional Solderability

Wave Soldering Percent Hole Fill Test

Conditions

• Test Vehicle: 1196 plated through-hole coated with AlphaSTAR
• 260°C lead-free reflow treatment, SLS65 no clean flux, 2 seconds contact time, greater than or equal to 100% barrel fill
• Thickness measurements taken on a 1.5 x1.5 mm pad
• Hole fill results are based on SnPb solder