• Corrosion & Tarnish Resistance
  • Creep & Flaking Corrosion Resistance
  • Tarnish Resistance
• Resistance to Microvoids
  • What are Planar Microvoids?
  • Why you should care about Microvoids
  • Microvoid Impact and Solder Cracking
  • Intel: AlphaSTAR vs. Historical Production Data
  • Intel: Design of Experiment
  • Intel: Board Failure Percent Due to Microvoids
• Solder Joint Reliability
• Solderability
  • Wave Soldering
  • Wetting Balance Test Results
• Process Overview
  • Process Cycle
  • OEM and Assembler Features and Benefits
  • Fabricator Features and Benefits
  • Test Results (SIR, EM, UL)
• AlphaSTAR Creates Value
  • AlphaSTAR Creates Value
  • AlphaSTAR Advantage

Tarnish Resistance

AlphaSTAR^® Tarnish Resistance vs. Competitive Immersion Silver

As shown above, AlphaSTAR immersion silver delivers superior tarnish resistance and has a wider operating window than a competitive silver, "C." Copper surfaces were exposed to 850C/85%RH for 24 hours. Competitive Process C shows significant tarnish, especially at thickness less than or equal to 6 microinches.