• Corrosion & Tarnish Resistance
  • Creep & Flaking Corrosion Resistance
  • Tarnish Resistance
• Resistance to Microvoids
  • What are Planar Microvoids?
  • Why you should care about Microvoids
  • Microvoid Impact and Solder Cracking
  • Intel: AlphaSTAR vs. Historical Production Data
  • Intel: Design of Experiment
  • Intel: Board Failure Percent Due to Microvoids
• Solder Joint Reliability
• Solderability
  • Wave Soldering
  • Wetting Balance Test Results
• Process Overview
  • Process Cycle
  • OEM and Assembler Features and Benefits
  • Fabricator Features and Benefits
  • Test Results (SIR, EM, UL)
• AlphaSTAR Creates Value
  • AlphaSTAR Creates Value
  • AlphaSTAR Advantage

Solder Joint Reliability

AlphaSTAR Lead-free Reliability

BGA shear testing demonstrates that cohesive failures (i.e., fractures) take place within the solder, not at the solder/copper interface, thus demonstrating that the strongest possible solder joints are achieved by using the AlphaSTAR immersion silver process. The solder joint strength is independent of the silver thickness (0.05 - 0.5 µm) and reflow treatment (up to 3 times).

Schematic Diagram of Shear Test

Pad Diameter: 0.5 mm
Solder ball diameter: 0.76 mm