Process Cycle

Cleaner

Removes soils, oils and oxidation from the exposed copper on the printed circuit board. The cleaner's lower surface tension delivers superior wetting of high-aspect ratio holes and microvias.

Microetch

Yields a micro-roughened, semi-bright surface topography, which greatly improves tarnish resistance.

Pre-Dip

Prevents contamination of the silver bath and prepares the copper for the displacement reaction that will occur in the silver bath by matching the chemical environment and pH of the silver plating solution.

Silver Plate

Slow and orderly deposition of silver results in a dense layer of small silver grains with a targeted thickness of 6-12 microinches.

Corrosion Inhibitor (optional)

Used as a final step to inhibit creep and flaking corrosion that can occur when free copper is exposed to a harsh environment on PWB circuitry.