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Benefit: |
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Inherently resistant to microvoids
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Consistently strong solder joints; eliminates product defects and failures
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Corrosion Inhibitor prevents Creep and Flaking Corrosion
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Extended product life; enhanced appearance.
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Excellent Pb-free and Sn/Pb solderability
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Easy Pb-free process development and soldering for high yields
Bridges the gap between current Sn/Pb and future Pb-free soldering
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Exceptional tarnish resistance
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Improved appearance
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Superior contact resistance, In-Circuit Testing Performance
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No false failure testing or production disruptions
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Proven long term reliability (SIR and EM)
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Confidence in protecting product value and OEM image
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Excellent flux material compatibility, even with difficult to solder no-clean fluxes
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Greater flexibility and independence of flux choice
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Solder mask compatible
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No solder mask requalification required
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Flat co-planar finish
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Enables consistent SMT fine pitch printing critical to microBGA devices reliability
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Robust metallic coating with chemical resistance
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Excellent soldering performance, even after misprint solder paste printing
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Easily fabricated by all PWB makers
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Global performance exact for improved consistency and reduced assembly variables delivers a more predictable performance
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RoHS and WEEE compliant
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Meets Pb-free environmental directives without increased costs; Enables OEM conversion to Pb-free
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