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Enthone® microelectronics materials for wafer bump plating, leadframes, connectors and passive components include:
- High performance alloys for wafer bump plating, including gold, copper, lead-free alloys and low alpha lead-based alloys
- Base and precious metal alloys for lead metallization that address tin whisker formation, solderability failures and other reliability problems.
Backed by global applications expertise, leading OEMs worldwide depend on Enthone microelectronic materials to enhance appearance and electronic performance.
Please select a Trade Name, Application, or Process from the above menus to view product details within the Microelectronics Materials section of the Enthone web site.
Process
Wafers
 Copper Damascene
 Wafer Bump Plating
 Gold - Bump Plating
 Tin-Lead/Tin Alloy/Pure Tin
 Copper - Bump Plating
IC Leadframes - Electroplating
 Nickel - IC Leadframes
 Palladium - IC Leadframes
 Silver - IC Leadframes
 Pure Tin - IC Leadframes
 Tin-Lead - IC Leadframes
 Tin Bismuth - IC Leadframes
Connectors - Electroplating
 Nickel - Connectors
 Gold - Connectors
 Palladium - Connectors
 Palladium Cobalt - Connectors
 Palladium - Nickel
 Pure Tin - Connectors
 Tin-Lead - Connectors
 Tin Bismuth - Connectors
Lead-free Systems
 Nickel - Lead-free Systems
 Pure Tin - Lead-free Systems
 Tin Bismuth - Lead-free Systems
Passive Components
EMI Plated Shielding
 Double-Sided Plating Coverage - EMI Shielding
 Selective Plating Process - EMI Shielding
Memory Disk Plating
 Pretreatment - Memory Disk
 Electroless Nickel - Memory Disk

Wafers
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MICROFAB® and NEUTRONEX® cyanide-free gold electroplating processes
are specially formulated to produce gold deposits for circuit patterns and
bumps on semiconductor wafers. Benefits include:
- Fine-grained, high purity deposits
- Excellent thickness distribution
- Consistent electrical properties/bondability
- Extended process life
- Compatibility with resist processes
The 99.99% pure gold processes meet the requirements of MIL-G-45204B, Amendment 2, Type I, Grade A and Type III. The processes may be used with all types of manual and automated plating equipment.
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| Product |
Description |
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 Process can operate over a broader range of current densities with good thermal stability. |
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 Recommended for copper or gold seed layered substrates. |
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 Recommended for Germanium oxide substrates. |
Tin-Lead/Tin Alloy/Pure Tin |
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MICROFAB® high purity tin, tin-silver and tin-lead processes produce fine-grained, matte to semi-bright deposits. They are specially formulated for the fabrication of circuit patterns and bumps on semiconductor wafers. MICROFAB processes contain no fluoborates or formaldehyde and include the following:
- Single additive, multi alloy processes
- Consistent alloy composition
- Uniform thickness
- Low alpha lead recycling
The processes may be used with all types of manual and automated plating equipment.
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| Product |
Description |
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 Low alpha lead-tin plating process produces pure lead or lead-rich tin-lead deposits. MSA-based. |
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 Lead-free, pure tin plating process may be used with soluble or insoluble anodes. MSA-based. |
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 Lead-free, pure tin plating process may be used with soluble anodes. Ideally suited for use with fountain or cup type, automatic bump plating equipment and with paddle type cells. Sulfate-based. |
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 Tin-silver system enables lead-free flip chip wafer bumping. Formulated to plate at high deposition rates while maintaining very tight bump height uniformity both “within the die” as well as “within the wafer,” the process provides a lead-free alternative to eutectic tin-lead bumping when plated at the ratio of 97.5Sn/2.5Ag. |
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Description |
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 High speed, MSA-based wafer bump plating process utilizes a single additive. The low maintenance system delivers the same unique features and benefits as MICROFAB SnAg 600. |
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 High purity copper process produces fine-grained matte deposits. High-build bumps may be produced on fine semiconductor wafers for superior bump and circuit line performance. Designed for use with insoluble anodes, the process yields excellent thickness distribution over the entire wafer surface for consistent electrical properties and bondability. |
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IC Leadframes - Electroplating
Connectors - Electroplating
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| Product |
Type |
Finish |
Speed |
Features/Benefits |
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 Cobalt Hardened |
 Bright |
 High |
 High efficiency, cobalt hardened acid gold process is capable of depositing gold at exceptionally high rates with excellent distribution. The process is ideally suited for all types of plating where increased deposition rates are required. Produces coatings with outstanding wear resistance. Meets MIL-G-45204C, Type 1, Grade C. |
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 Cobalt Hardened |
 Bright |
 Medium |
 Bright gold process delivers excellent distribution at high current densities with a low gold concentration. Suitable for reel-to-reel, rack, barrel and vibratory plating. Produces coatings with outstanding wear resistance. Meets MIL-G-45204C, Type 1, Grade C. |
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 Nickel Hardened
Cobalt Hardened |
 Bright |
 Medium
Low |
 Acid, nickel-hardened and cobalt-hardened gold electroplating processes contain a stable and analyzable electrolyte for producing deposits with consistent physical and functional properties. Deposits are fully bright and exhibit excellent resistance to wear and corrosion. The process provides uniform gold thickness distribution and is recommended for plating connectors, contacts, switches and other electronic devices. The processes may be used for barrel operations. Meets the requirement of Military Plating Specification MIL-G-45204C, Amendment 2, Types I and II, Grade C. |
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Finish |
Speed |
Features/Benefits |
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 Matte |
 High
Medium |
 Designed for the deposition of reflowable, pure tin in medium and high speed plating equipment for the plating of terminals, solid stock and wire. The additive system is specifically designed to produce pure tin deposits with minimum organic inclusions exhibiting excellent covering power, high degree of ductility and good solderability over wide temperature and current density ranges. Deposits have a consistent and stable surface morphology and are suitable as a “low whisker” lead-free alternative finish. Meets the requirements of MIL-STD-202F, Test Method 208F, J-STD-002 and J-STD-003. |
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 Bright |
 High |
 Additive system is specifically designed to produce deposits with minimum organic inclusions exhibiting excellent brightness and solderability over a wide range of solution temperatures. Deposits have a consistent and stable surface morphology and are suitable as a “low whisker” lead-free alternative finish. Exceeds the requirements of MIL-STD-202F, Test Method 208F and MIL-STD-883C, Test Method 2003. |
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 Bright |
 Low |
 Specially designed for rack and barrel plating systems, the process may be used for a diversity of applications, including electronic housings and connectors. Maintains consistent and reliable deposit properties under a wide range of operating parameters. Parts processed exhibit exceptional solderability with a bright, uniform appearance. Since the electrolyte used in the STANNOSTAR GSB 3 is sulfuric acid rather than MSA, the process has a very low cost of ownership. |
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Finish |
Speed |
Features/Benefits |
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 Matte |
 Low |
 Fluoborate-free, low foaming, formaldehyde-free tin-lead plating system especially formulated to produce matte to semi bright tin and tin-lead deposits for rack and barrel plating conditions. Typical solutions include 60/40, 90/10 and 98/2 tin-lead alloys and pure tin. The solutions can be operated over a wide range of operating parameters including current density and agitation, while maintaining constant deposit properties. When neutralizing the rinse water the tin and lead salts will precipitate completely, an important improvement over fluoborate systems. Process plates consistently uniform solder alloy compositions. |
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 Bright |
 Low |
 Fluoborate-free, low foaming, formaldehyde-free tin-lead plating system especially formulated to produce bright tin and tin-lead deposits for rack and barrel plating conditions. Typical solutions include 60/40, 90/10 and 98/2 tin-lead alloys and pure tin. The solutions can be operated over a wide range of operating parameters including current density and agitation, while maintaining constant deposit properties. When neutralizing the rinse water the tin and lead salts will precipitate completely, an important improvement over fluoborate systems. Process plates consistently uniform and bright solder alloy compositions that eliminate uneven, "blotchy" areas. The deposits have excellent solderability that meet MIL-STD-202. |
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 Bright |
 High
Medium |
 Formulated for medium and high speed plating conditions, the tin-lead system delivers the same superior results and exceeds the same MIL requirements as STANNOSTAR GMB. |
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Passive Components
Lead-free Systems
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| Product |
Finish |
Speed |
Features/Benefits |
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 Matte |
 High
Medium |
 Designed for the deposition of reflowable, pure tin in medium and high speed plating equipment for the plating of terminals, solid stock and wire. The additive system is specifically designed to produce pure tin deposits with minimum organic inclusions exhibiting excellent covering power, high degree of ductility and good solderability over wide temperature and current density ranges. Deposits have a consistent and stable surface morphology and are suitable as a “low whisker” lead-free alternative finish. Meets the requirements of MIL-STD-202F, Test Method 208F, J-STD-002 and J-STD-003. |
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 Bright |
 High |
 Additive system is specifically designed to produce deposits with minimum organic inclusions exhibiting excellent brightness and solderability over a wide range of solution temperatures. Deposits have a consistent and stable surface morphology and are suitable as a “low whisker” lead-free alternative finish. Exceeds the requirements of MIL-STD-202F, Test Method 208F and MIL-STD-883C, Test Method 2003. |
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 Bright |
 Low |
 Specially designed for rack and barrel plating systems, the process may be used for a diversity of applications, including electronic housings and connectors. Maintains consistent and reliable deposit properties under a wide range of operating parameters. Parts processed exhibit exceptional solderability with a bright, uniform appearance. Since the electrolyte used in the STANNOSTAR GSB 3 is sulfuric acid rather than MSA, the process has a very low cost of ownership. |
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EMI Plated Shielding
Memory Disk Plating
Quality Assured Preplate Technology
Proper surface preparation of aluminum disks is as important as the selection of the nickel process itself for achieving a quality deposit for subsequent sputtering. Consistent and successful plating is achieved when cleaner, acid conditioner, zincate selection, and operating conditions have been given proper consideration. Cleaners remove all soils and surface contaminants without chemically or physically disturbing the substrate. Acid conditioners provide a homogeneous, electrochemically active surface receptive to immersion zinc processes. The zincating operation further cleans and deoxidizes the aluminum surface, providing a thin, dense, uniform barrier deposit against oxidation prior to electroless nickel plating. Once the optimum preplate cycle has been completed, the electroless nickel plating process can proceed with confidence.
In order to meet these cleaning requirements, Enthone pretreatment and electroless nickel technology is supplied as Quality Assured (QA) products. Each pretreatment product listed below is engineered to optimize final product.
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Cycle |
Features/Benefits |
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 Soak Clean |
 High detergent, alkaline, non-silicated, very-low-etch clear soak cleaner. ENPREP 8744 (QA) is provided as a single-component liquid material. It is ideally suited for moderate to heavy-duty cleaning of aluminum rigid memory disks. ENPREP 8744 (QA) is Quality Assured Grade and specially filtered (0.45 mµ nominal). |
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 Acid Etch |
 Specially filtered (0.45 mµ nominal), acidic liquid concentrate is chelate-free and is especially effective on difficult-to-plate alloys, particularly those rich in magnesium, (e.g. 5086, 5052 alloys) and for applications where minimal dimensional changes and maximum reflectivity is required. ACTANE 4322S (QA) is ideal for high-finish aluminum surfaces because it does not appreciably change the appearance and finish of polished aluminum. Because ACTANE 4322S (QA) is chelate-free, it minimizes the possibility of cross contamination of other solutions due to drag-in. |
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 1st Zincate |
 Micron filtered (0.45 mµ nominal) cyanide-free zincate process that is less aggressive to aluminum substrates than conventional zincates. Alumon 5825 (QA) minimizes etching of the aluminum substrate while applying a very thin, uniform, fine grain zinc film. |
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 Strip |
 Liquid concentrate that is added to nitric acid. Designed to improve zincate removal from aluminum. The substrate is also conditioned, so that a thin-uniform zinc coating is obtained from the second zinc immersion treatment, prior to electroless nickel plating. |
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 2nd Zincate |
 See description above. |
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