Enthone® microelectronics materials for wafer bump plating, leadframes, connectors and passive components include:

• High performance alloys for wafer bump plating, including gold, copper, lead-free alloys and low alpha lead-based alloys
• Base and precious metal alloys for lead metallization that address tin whisker formation, solderability failures and other reliability problems.

Backed by global applications expertise, leading OEMs worldwide depend on Enthone microelectronic materials to enhance appearance and electronic performance.

Please select a Trade Name, Application, or Process from the above menus to view product details within the Microelectronics Materials section of the Enthone web site.

Process
Wafers
Copper Damascene
Wafer Bump Plating
Gold - Bump Plating
Tin-Lead/Tin Alloy/Pure Tin
Copper - Bump Plating
IC Leadframes - Electroplating
Nickel - IC Leadframes
Palladium - IC Leadframes
Silver - IC Leadframes
Pure Tin - IC Leadframes
Tin-Lead - IC Leadframes
Tin Bismuth - IC Leadframes
Connectors - Electroplating
Nickel - Connectors
Gold - Connectors
Palladium - Connectors
Palladium Cobalt - Connectors
Palladium - Nickel
Pure Tin - Connectors
Tin-Lead - Connectors
Tin Bismuth - Connectors
Lead-free Systems
Nickel - Lead-free Systems
Pure Tin - Lead-free Systems
Tin Bismuth - Lead-free Systems
Passive Components
EMI Plated Shielding
Double-Sided Plating Coverage - EMI Shielding
Selective Plating Process - EMI Shielding
Memory Disk Plating
Pretreatment - Memory Disk
Electroless Nickel - Memory Disk

Wafers

	Copper Damascene
Product Features/Benefits ViaForm® Enthone ViaForm® copper damascene electrochemical deposition processes for wafer fabrication provide superior filling performance. The latest generation is designed to master the complex process requirements of sub-90 nanometer interconnects, with extendibility to 65 nanometer nodes. Unique characteristics of the process chemistry include...

	Wafer Bump Plating
Gold MICROFAB® and NEUTRONEX® cyanide-free gold electroplating processes are specially formulated to produce gold deposits for circuit patterns and bumps on semiconductor wafers. Benefits include: Fine-grained, high purity deposits Excellent thickness distribution Consistent electrical properties/bondability Extended process life Compatibility with resist processes The 99.99% pure gold processes meet the requirements of MIL-G-45204B, Amendment 2, Type I, Grade A and Type III. The processes may be used with all types of manual and automated plating equipment. Product Description MICROFAB® AU-660 Process can operate over a broader range of current densities with good thermal stability. NEUTRONEX® 309 Recommended for copper or gold seed layered substrates. NEUTRONEX® 309i Recommended for Germanium oxide substrates. Tin-Lead/Tin Alloy/Pure Tin MICROFAB® high purity tin, tin-silver and tin-lead processes produce fine-grained, matte to semi-bright deposits. They are specially formulated for the fabrication of circuit patterns and bumps on semiconductor wafers. MICROFAB processes contain no fluoborates or formaldehyde and include the following: Single additive, multi alloy processes Consistent alloy composition Uniform thickness Low alpha lead recycling The processes may be used with all types of manual and automated plating equipment. Product Description MICROFAB® PB-300 Low alpha lead-tin plating process produces pure lead or lead-rich tin-lead deposits. MSA-based. MICROFAB® SN-200 Lead-free, pure tin plating process may be used with soluble or insoluble anodes. MSA-based. MICROFAB® SN-530 Lead-free, pure tin plating process may be used with soluble anodes. Ideally suited for use with fountain or cup type, automatic bump plating equipment and with paddle type cells. Sulfate-based. MICROFAB® SnAg 600 Tin-silver system enables lead-free flip chip wafer bumping. Formulated to plate at high deposition rates while maintaining very tight bump height uniformity both “within the die” as well as “within the wafer,” the process provides a lead-free alternative to eutectic tin-lead bumping when plated at the ratio of 97.5Sn/2.5Ag. Copper Product Description MICROFAB® CU MSA 100 High speed, MSA-based wafer bump plating process utilizes a single additive. The low maintenance system delivers the same unique features and benefits as MICROFAB SnAg 600. MICROFAB® SC High purity copper process produces fine-grained matte deposits. High-build bumps may be produced on fine semiconductor wafers for superior bump and circuit line performance. Designed for use with insoluble anodes, the process yields excellent thickness distribution over the entire wafer surface for consistent electrical properties and bondability.

	Nickel
Product Finish Speed Features/Benefits LECTRO-NIC® 10-03 Semi-Bright High Nickel sulfamate process delivers a semi-bright, low stress deposit. The process is used with soluble anodes and sulfamate chemistry in an air agitated plating cell. The deposit is slightly tensile stressed and ductile. The replenisher component is extremely stable and provides for precise control of the electrolyte for consistent deposit performance. LECTRO-NIC deposits conform to Military Plating Specification QQ-N-290, Class 2, Amendment 1. SULFAMEX® MLS Matte High Provides a soft, ductile nickel underlayer for subsequent processing with a noble metal top layer finish. Multi-layer finish delivers high solderability and wire bondability to meet MIL-STD-883C, Methods 2003.5 and 2022.2. Chemistry is easy to use, control and maintain. LECTRO-NIC® OXR-1300 Semi-Bright High The nickel sulfate process is specially formulated to prevent discoloration of STANNOSTAR pure tin during heat-up and reflow operations while maintaining exceptional solderability. Hinders whiskers growth caused by diffusion as stress initiator. Superior operating flexibility delivers a robust performance. May be used for high speed deposition including reel-to-reel.

	Palladium
Product Finish Speed Features/Benefits PALLADEX® PdLT Bright High Designed for the deposition of pure palladium on leadframes and other semiconductor devices. Produces bright, ductile, deposits exhibiting the properties required for exceptional solderability and wirebonding performance after thermal or steam aging. This makes it an excellent choice of finishes for high reliability device fabrication. The solution is capable of producing rapid plating rates due to its high efficiency and is easily maintained with standard analytical techniques. PALLADEX® PdM2 Bright High Low Designed for the deposition of pure palladium on electronic components using high speed (HS) or low speed (LS) plating techniques. Produces bright, ductile, deposits exhibiting the properties required for exceptional contact stability. The solution is capable of producing very high plating rates and is easily maintained with standard techniques. The PALLADEX PdM2 process can be operated at neutral pH values, and is less corrosive than traditional processes. The process allows for lower ammonia usage resulting in reduced odor.

	Silver
Product Finish Speed Features/Benefits SILVREX® JS-5 Series Bright High Medium Low Silver plating process produces silver deposits of 99.9% purity. The process produces a fine grained deposit over a wide range of current densities. SILVREX JS-5 is designed to operate in manual and automatic selective spot plating equipment as well as selective reel-to-reel equipment.

	Pure Tin
Product Finish Speed Features/Benefits STANNOSTAR® HMM2 Matte High Medium Designed for the deposition of reflowable, pure tin in medium and high speed plating equipment for the plating of terminals, solid stock and wire. The additive system is specifically designed to produce pure tin deposits with minimum organic inclusions exhibiting excellent covering power, high degree of ductility and good solderability over wide temperature and current density ranges. Deposits have a consistent and stable surface morphology and are suitable as a “low whisker” lead-free alternative finish. Meets the requirements of MIL-STD-202F, Test Method 208F, J-STD-002 and J-STD-003.

	Tin-Lead
Product Finish Speed Features/Benefits STANNOSTAR® GMM Matte Low Fluoborate-free, low foaming, formaldehyde-free tin-lead plating system especially formulated to produce matte to semi bright tin and tin-lead deposits for rack and barrel plating conditions. Typical solutions include 60/40, 90/10 and 98/2 tin-lead alloys and pure tin. The solutions can be operated over a wide range of operating parameters including current density and agitation, while maintaining constant deposit properties. When neutralizing the rinse water the tin and lead salts will precipitate completely, an important improvement over fluoborate systems. Process plates consistently uniform solder alloy compositions.

	Tin Bismuth
Product Finish Speed Features/Benefits STANNOSTAR® SnBi Matte High Tin-Bismuth 98/2 alloy solder process has been designed for the deposition of a 98% tin alloy. The additive system is specifically designed to produce deposits with minimum organic inclusions, thereby exhibiting excellent solderability. Deposits have a consistent and stable surface morphology. Exceeds the requirements of MIL-STD-202F, Test Method 208F and MIL-STD-883C, Test Method 2003.

	Nickel
Product Finish Speed Features/Benefits LECTRO-NIC® OXR-1300 Semi-Bright High The nickel sulfate process is specially formulated to prevent discoloration of STANNOSTAR pure tin during heat-up and reflow operations while maintaining exceptional solderability. Hinders whiskers growth caused by diffusion as stress initiator. Superior operating flexibility delivers a robust performance. May be used for high speed deposition including reel-to-reel.

	Gold
Product Type Finish Speed Features/Benefits AUTRONEX® GVC Cobalt Hardened Bright High High efficiency, cobalt hardened acid gold process is capable of depositing gold at exceptionally high rates with excellent distribution. The process is ideally suited for all types of plating where increased deposition rates are required. Produces coatings with outstanding wear resistance. Meets MIL-G-45204C, Type 1, Grade C. AUTRONEX® HSLG Cobalt Hardened Bright Medium Bright gold process delivers excellent distribution at high current densities with a low gold concentration. Suitable for reel-to-reel, rack, barrel and vibratory plating. Produces coatings with outstanding wear resistance. Meets MIL-G-45204C, Type 1, Grade C. AUTRONEX® 2910 / 2910C Nickel Hardened Cobalt Hardened Bright Medium Low Acid, nickel-hardened and cobalt-hardened gold electroplating processes contain a stable and analyzable electrolyte for producing deposits with consistent physical and functional properties. Deposits are fully bright and exhibit excellent resistance to wear and corrosion. The process provides uniform gold thickness distribution and is recommended for plating connectors, contacts, switches and other electronic devices. The processes may be used for barrel operations. Meets the requirement of Military Plating Specification MIL-G-45204C, Amendment 2, Types I and II, Grade C.

	Palladium
Product Finish Speed Features/Benefits PALLADEX® PdM2 Bright High Low Designed for the deposition of pure palladium on electronic components using high speed (HS) or low speed (LS) plating techniques. Produces bright, ductile, deposits exhibiting the properties required for exceptional contact stability. The solution is capable of producing very high plating rates and is easily maintained with standard techniques. The PALLADEX PdM2 process can be operated at neutral pH values, and is less corrosive than traditional processes. The process allows for lower ammonia usage resulting in reduced odor.

	Palladium Cobalt
Product Finish Speed Features/Benefits PALLADEX® PdCo PC-1 LS Bright Low Drop-in replacement for hard gold reduces precious metal consumption by up to 60%. Accurate determination of the plated thickness is easy to control as the cobalt alloy does not interfere with the nickel signal during XRF thickness readings. The deposit exhibits excellent contact, wear and corrosion resistance. Ideal for rack and barrel processes, the lead-free material provides 100% whisker-free surfaces.

	Palladium Nickel
Product Finish Speed Features/Benefits PALLADEX® PdNiM2 HS PALLADEX® PdNiM2 LS Bright High Drop-in replacement for hard gold delivers a thin, uniform deposit density that reduces precious metal consumption by up to 60%. The bright, ductile deposit exhibits excellent contact, wear and corrosion resistance. The lead-free material provides 100% whisker-free surfaces.

	Pure Tin
Product Finish Speed Features/Benefits STANNOSTAR® HMM2 Matte High Medium Designed for the deposition of reflowable, pure tin in medium and high speed plating equipment for the plating of terminals, solid stock and wire. The additive system is specifically designed to produce pure tin deposits with minimum organic inclusions exhibiting excellent covering power, high degree of ductility and good solderability over wide temperature and current density ranges. Deposits have a consistent and stable surface morphology and are suitable as a “low whisker” lead-free alternative finish. Meets the requirements of MIL-STD-202F, Test Method 208F, J-STD-002 and J-STD-003. STANNOSTAR® 1405 Bright High Additive system is specifically designed to produce deposits with minimum organic inclusions exhibiting excellent brightness and solderability over a wide range of solution temperatures. Deposits have a consistent and stable surface morphology and are suitable as a “low whisker” lead-free alternative finish. Exceeds the requirements of MIL-STD-202F, Test Method 208F and MIL-STD-883C, Test Method 2003. STANNOSTAR® GSB 3 Bright Low Specially designed for rack and barrel plating systems, the process may be used for a diversity of applications, including electronic housings and connectors. Maintains consistent and reliable deposit properties under a wide range of operating parameters. Parts processed exhibit exceptional solderability with a bright, uniform appearance. Since the electrolyte used in the STANNOSTAR GSB 3 is sulfuric acid rather than MSA, the process has a very low cost of ownership.

	Tin-Lead
Product Finish Speed Features/Benefits STANNOSTAR® GMM Matte Low Fluoborate-free, low foaming, formaldehyde-free tin-lead plating system especially formulated to produce matte to semi bright tin and tin-lead deposits for rack and barrel plating conditions. Typical solutions include 60/40, 90/10 and 98/2 tin-lead alloys and pure tin. The solutions can be operated over a wide range of operating parameters including current density and agitation, while maintaining constant deposit properties. When neutralizing the rinse water the tin and lead salts will precipitate completely, an important improvement over fluoborate systems. Process plates consistently uniform solder alloy compositions. STANNOSTAR® GMB Bright Low Fluoborate-free, low foaming, formaldehyde-free tin-lead plating system especially formulated to produce bright tin and tin-lead deposits for rack and barrel plating conditions. Typical solutions include 60/40, 90/10 and 98/2 tin-lead alloys and pure tin. The solutions can be operated over a wide range of operating parameters including current density and agitation, while maintaining constant deposit properties. When neutralizing the rinse water the tin and lead salts will precipitate completely, an important improvement over fluoborate systems. Process plates consistently uniform and bright solder alloy compositions that eliminate uneven, "blotchy" areas. The deposits have excellent solderability that meet MIL-STD-202. STANNOSTAR® HMB Bright High Medium Formulated for medium and high speed plating conditions, the tin-lead system delivers the same superior results and exceeds the same MIL requirements as STANNOSTAR GMB.

	Tin Bismuth
Product Finish Speed Features/Benefits STANNOSTAR® SnBi Matte High Tin-Bismuth 98/2 alloy solder process has been designed for the deposition of a 98% tin alloy. The additive system is specifically designed to produce deposits with minimum organic inclusions, thereby exhibiting excellent solderability. Deposits have a consistent and stable surface morphology. Exceeds the requirements of MIL-STD-202F, Test Method 208F and MIL-STD-883C, Test Method 2003.

Product Finish Speed Features/Benefits STANNOSTAR® CMM Matte Low Non-fluoborate electrolyte especially designed for MLCC and Chip Resistor plating in barrel and/or RFT plating applications. Electrolyte delivers matte, pure tin deposits with excellent metal distribution and solderability. Especially formulated to avoid “coupling” effects.

	Nickel
Product Finish Speed Features/Benefits LECTRO-NIC® OXR-1300 Semi-Bright High The nickel sulfate process is specially formulated to prevent discoloration of STANNOSTAR pure tin during heat-up and reflow operations while maintaining exceptional solderability. Hinders whiskers growth caused by diffusion as stress initiator. Superior operating flexibility delivers a robust performance. May be used for high speed deposition including reel-to-reel.

	Pure Tin
Product Finish Speed Features/Benefits STANNOSTAR® HMM2 Matte High Medium Designed for the deposition of reflowable, pure tin in medium and high speed plating equipment for the plating of terminals, solid stock and wire. The additive system is specifically designed to produce pure tin deposits with minimum organic inclusions exhibiting excellent covering power, high degree of ductility and good solderability over wide temperature and current density ranges. Deposits have a consistent and stable surface morphology and are suitable as a “low whisker” lead-free alternative finish. Meets the requirements of MIL-STD-202F, Test Method 208F, J-STD-002 and J-STD-003. STANNOSTAR® 1405 Bright High Additive system is specifically designed to produce deposits with minimum organic inclusions exhibiting excellent brightness and solderability over a wide range of solution temperatures. Deposits have a consistent and stable surface morphology and are suitable as a “low whisker” lead-free alternative finish. Exceeds the requirements of MIL-STD-202F, Test Method 208F and MIL-STD-883C, Test Method 2003. STANNOSTAR® GSB 3 Bright Low Specially designed for rack and barrel plating systems, the process may be used for a diversity of applications, including electronic housings and connectors. Maintains consistent and reliable deposit properties under a wide range of operating parameters. Parts processed exhibit exceptional solderability with a bright, uniform appearance. Since the electrolyte used in the STANNOSTAR GSB 3 is sulfuric acid rather than MSA, the process has a very low cost of ownership.

	Tin Bismuth
Product Finish Speed Features/Benefits STANNOSTAR® SnBi Matte High Tin-Bismuth 98/2 alloy solder process has been designed for the deposition of a 98% tin alloy. The additive system is specifically designed to produce deposits with minimum organic inclusions, thereby exhibiting excellent solderability. Deposits have a consistent and stable surface morphology. Exceeds the requirements of MIL-STD-202F, Test Method 208F and MIL-STD-883C, Test Method 2003.

	Double-Sided Plating Coverage
Product Features/Benefits ENSHIELD® The ENSHIELD process produces a uniform metal film over the entire plastic part. The process involves a series of sequential steps designed to accomplish three primary objectives. First, is the development of adhesion or bonding sites on the surface of the plastic. Second, a sequence of steps is employed to convert the plastic surface to one that is catalytic to the plating process. This catalyzation of the plastic produces a surface that is autocatalytic to electroless plating. This is normally accomplished with a tin-palladium catalyst. Finally, parts enter the electroless copper process for the development of the conductive layer. The actual plated thickness is often determined by the conductivity specification, either point-to-point or ohms/square, which is imposed by the OEM. Once the required copper thickness is achieved, the copper is initiated to facilitate electroless nickel plating. The thickness of the nickel film is normally within 10-25µin, which is adequate to provide corrosion and abrasion protection to the underlying copper in most applications...

	Selective Plating Process
Product Features/Benefits ENSHIELD PLUS® The ENSHIELD PLUS process is designed to provide selective electroless plating onto a wide variety of plastic parts. It is often used for in-color molded plastic parts, to avoid the need for final finishing. The ENSHIELD PLUS process utilizes a catalytic, base coating as the primary mechanism for achieving adhesion to the plastic part and for producing a surface that is autocatalytic to the electroless plating process. This process is also employed for a variety of applications where metallization is required only on specific areas of a part or component...

Quality Assured Preplate Technology
Proper surface preparation of aluminum disks is as important as the selection of the nickel process itself for achieving a quality deposit for subsequent sputtering. Consistent and successful plating is achieved when cleaner, acid conditioner, zincate selection, and operating conditions have been given proper consideration. Cleaners remove all soils and surface contaminants without chemically or physically disturbing the substrate. Acid conditioners provide a homogeneous, electrochemically active surface receptive to immersion zinc processes. The zincating operation further cleans and deoxidizes the aluminum surface, providing a thin, dense, uniform barrier deposit against oxidation prior to electroless nickel plating. Once the optimum preplate cycle has been completed, the electroless nickel plating process can proceed with confidence.

In order to meet these cleaning requirements, Enthone pretreatment and electroless nickel technology is supplied as Quality Assured (QA) products. Each pretreatment product listed below is engineered to optimize final product.

	Pretreatment
Product Cycle Features/Benefits ENPREP® 8744 (QA) Soak Clean High detergent, alkaline, non-silicated, very-low-etch clear soak cleaner. ENPREP 8744 (QA) is provided as a single-component liquid material. It is ideally suited for moderate to heavy-duty cleaning of aluminum rigid memory disks. ENPREP 8744 (QA) is Quality Assured Grade and specially filtered (0.45 mµ nominal). ACTANE® 4322S (QA) Acid Etch Specially filtered (0.45 mµ nominal), acidic liquid concentrate is chelate-free and is especially effective on difficult-to-plate alloys, particularly those rich in magnesium, (e.g. 5086, 5052 alloys) and for applications where minimal dimensional changes and maximum reflectivity is required. ACTANE 4322S (QA) is ideal for high-finish aluminum surfaces because it does not appreciably change the appearance and finish of polished aluminum. Because ACTANE 4322S (QA) is chelate-free, it minimizes the possibility of cross contamination of other solutions due to drag-in. ALUMON® 5825 (QA) 1st Zincate Micron filtered (0.45 mµ nominal) cyanide-free zincate process that is less aggressive to aluminum substrates than conventional zincates. Alumon 5825 (QA) minimizes etching of the aluminum substrate while applying a very thin, uniform, fine grain zinc film. ACTANE® 2969 + 50% Nitric Acid Strip Liquid concentrate that is added to nitric acid. Designed to improve zincate removal from aluminum. The substrate is also conditioned, so that a thin-uniform zinc coating is obtained from the second zinc immersion treatment, prior to electroless nickel plating. ALUMON® 5825 (QA) 2nd Zincate See description above.

	Electroless Nickel
Product Features/Benefits ENPLATE® NI-1450 (QA) Provides uniform initiation, excellent stability and a consistent plating rate. Deposits produced from ENPLATE NI-1450 (QA) operating solutions exhibit superior smoothness with minimal nodulation. Plating thicknesses can be reduced and polishing times minimized. The ENPLATE NI-1450 (QA) deposit is paramagnetic as plated and remains essentially paramagnetic after heat treating at 315 °C for ten minutes. ENPLATE NI-1450 (QA) is engineered to accommodate the most stringent performance requirements.