ENTEK^® OM Visual Inspection and ICT

Pb-free Wave Solder Reflow Results

Enhanced Appearance

• Simple, four-step process inhibits galvanic etch effect, resulting in enhanced PWB appearance and reliability.
• Suited for both vertical and horizontal operations.
• Enhanced appearance and solderability through 5x lead-free reflow cycles, when run according to accepted industry standards.

ICT Capability

• Low contact resistance allows for high first-pass yields at ICT.
• Provides a visible coating for ease of bare board testing.
• Eliminates need to paste test points during board assembly.