ENTEK® OM Process Cycle
The ENTEK OM simple, four-step process inhibits galvanic etch effects, resulting in enhanced PWB reliability. Due to the proprietary plating mechanism, the process also eliminates the potential for microvoids. ENTEK OM utilizes a patented, Organic Metal® technology that ensures the surface finish is in place and ready for assembly.
An aggressive acid cleaner provides excellent copper conditioning and enables superior soldering performance.
An easy-to-control microetch safely removes trace contaminates and provides a uniform surface and appearance.
A proprietary process reduces preclean drag-in and prepares the copper surface for a more stable, reliable coating. The pre-dip provides additional overall savings on chemistry running cost.
Passivates the copper surface by depositing 50-70 nm of a patented, organic metal® that ensures the surface finish is in place and ready for assembly.