ENTEK® OM Exceptional Solderability

Higher Assembly Yields Reduce Cost

Wave Solder Results

ENTEK OM offers superior hole fill at wave solder versus traditional organic solderability preservative processes.

  • Enhanced solderability results in fewer customer returns.
  • Superior solderability versus traditional organic solderability preservatives, especially after multiple, lead-free wave solder reflows.
  • Longer hold times between heat cycles possible.
  • Robust assembly window.
Wave Solder Flux Loading

Lower Flux Loading = Reduced Costs

  • Traditional organic solderability preservative coatings require approximately 1400µg/sq. inch flux loading compared to metallic surface finishes which require 1000µg/sq. inch during the wave solder process.
  • Due to its unique Organic Metal® properties, ENTEK OM allows lower flux loading, resulting in assembly process savings.
  • ENTEK OM is a robust process that will deliver higher assembly yields.
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