Superior Throwing Power
- ELPLEYT® GS-7 reliably deposits nickel thickness in extremely low current density (LCD) areas. The process provides improved, consistent thickness in LCD areas versus traditional nickel processes.
- The immediate improvement in throwing power versus traditional bright nickel processes results in reduced nickel metal consumption, new design enablement, and increased performance.
- ELPELYT GS-7 meets minimum nickel thickness requirements without over plating in high current density (HCD) areas. Substantial reduction in nickel consumption.
- Plating nickel in extreme LCD areas enhances corrosion resistance, increases chrome coverage and reduces rejects and failures.
ELPELYT® GS-7 provides more nickel deposited across the entire current density range.