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Enthone Opens Semiconductor Applications Center in Taiwan
Cookson Electronics Introduces New Products at PV Valencia Exhibition
U.S. Patent Assigned to ViaForm® Leveler Copper Damascene Electroplating Chemistry
Enthone Celebrates Grand Opening of Advanced Applications Laboratory
Enthone Expands Operations in East of Europe
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Trusted Brands

Listed below are just some of the brands our customers have come to trust. For more information on any Enthone® technology, contact your local representative.

Semiconductor Interconnect Materials

  • ViaForm® wafer copper plating
  • MICROFAB® wafer bump gold, silver, tin and tin-lead processes

Functional Coatings for Wear and Corrosion Resistance

  • UDIQUE® plating on plastics
  • PERMA PASS® trivalent passivates
  • ENfinity electroless nickel
  • ZINCROLYTE® zinc plating systems
  • ENSEAL® topcoats
  • ANKOR® hard chrome

Printed Circuit Board Fabrication Chemistries

  • ENTEK® PLUS organic solderability preservatives
  • AlphaPREP® oxide replacement systems
  • ENVISION® HDI direct metallization
  • ENTHONE® DSR-3241 solder masks

Decorative Coatings

  • SEL-REX® precious metals
  • BRONZEX® white bronze
  • ARTFORM gold electroforming
  • PEARLBRITE® satin nickel

Microelectronics Materials

  • STANNOSTAR® tin and tin-lead processes
  • PALLADEX® palladium and palladium tin processes